Black Semiconductor

Growth

Innovating microchip technology with integrated electronic-photonic circuits.

Share:
Funding

€32.6M

HQ City

Aachen

Revenue Model

B2B

Employee Count

21-100

Last Round

06/2024

Stage

Growth

Team Growth

63%

Website Growth

0%

Integrated Photonics Packaging Engineer

Black Semiconductor

Innovating microchip technology with integrated electronic-photonic circuits.

Innovating microchip technology with integrated electronic-photonic circuits.

Aachen

Taufkirchen

• Experienced

• On-Site

• Other Engineering

2025-04-29 0:01:22

2025-04-29 0:01:22

About Company
About Company
About Company

TL;DR

TL;DR
✨ The Role in One Sentence

Black Semiconductor is seeking an Integrated Photonics Packaging Engineer to lead the development of next-generation optical interconnects and efficient optical I/O modules.

📋 What You'll Likely Do
  • 30%: Design and produce efficient optical I/O modules from concept to volume production.

  • 30%: Collaborate with vendors and OSATs to evaluate laser sources and packaging solutions.

  • 40%: Build and test prototypes, contributing to the development of cutting-edge technologies.

🧑‍💻 Profiles Doing This Job
  • High Priority: Master’s degree or above in a relevant technical field.

  • High Priority: 5+ years of experience in opto-mechanical packaging solutions.

  • High Priority: Experience with 2D, 2.5D or 3D packaging solutions and photonics integration.

📈 How This Role Will Look on Your CV
  • Led the development of next-generation optical interconnects and efficient optical I/O modules.

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