Integrated Photonics Packaging Engineer
• Experienced
• On-Site
• Other Engineering
Mark status as:
✨ The Role in One Sentence
Black Semiconductor is seeking an Integrated Photonics Packaging Engineer to lead the development of next-generation optical interconnects and efficient optical I/O modules.
📋 What You'll Likely Do
30%: Design and produce efficient optical I/O modules from concept to volume production.
30%: Collaborate with vendors and OSATs to evaluate laser sources and packaging solutions.
40%: Build and test prototypes, contributing to the development of cutting-edge technologies.
🧑💻 Profiles Doing This Job
High Priority: Master’s degree or above in a relevant technical field.
High Priority: 5+ years of experience in opto-mechanical packaging solutions.
High Priority: Experience with 2D, 2.5D or 3D packaging solutions and photonics integration.
📈 How This Role Will Look on Your CV
Led the development of next-generation optical interconnects and efficient optical I/O modules.