✨ The Role in One Sentence

Black Semiconductor is seeking a Senior Advanced Packaging Architect to design advanced packaging solutions for high-performance SOCs.

📋 What You'll Likely Do

• 40%: Design and implement advanced packaging solutions for heterogeneous SOCs using chiplet architecture.

• 30%: Interface with foundries and OSATs for vendor evaluation, technology selection, and manufacturing.

• 30%: Document SOC Advanced Packaging Product Requirement Specifications, IP roadmaps, and Customer Packaging Requirement Documents.

🧑‍💻 Profiles Doing This Job

• High Priority: 10+ years of experience in semiconductor packaging with advanced techniques.

• High Priority: Experience with 2.5D/3D heterogeneous integration technologies.

• High Priority: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science.

📈 How This Role Will Look on Your CV

• Architected advanced packaging solutions for next-generation SOCs in a photonics product development team.