✨ The Role in One Sentence

Black Semiconductor is seeking a Senior Advanced Packaging Architect to design advanced packaging solutions for high-performance SOCs targeting data centers and edge AI.

📋 What You'll Likely Do

• 40%: Design and implement advanced packaging solutions for heterogeneous silicon and photonics SOCs using chiplet architecture.

• 30%: Interface with foundries and OSATs for vendor evaluation, technology selection, and feasibility studies.

• 30%: Document product requirements, IP roadmaps, and customer packaging requirements.

🧑‍💻 Profiles Doing This Job

• High Priority: 10+ years in semiconductor packaging with advanced techniques like 2.5D/3D integration.

• High Priority: Experience with heterogeneous integration technologies such as SoIC, CoWoS, and WoW.

• High Priority: Bachelor's degree in Electrical Engineering, Mechanical Engineering, or Materials Science.

📈 How This Role Will Look on Your CV

• Architected advanced packaging solutions for next-generation SOCs in a photonics product development team.